HDC Technologies is an authorized sales rep for DDi Corporation (USA) for Printed Circuit Board products in India.
Headquartered in Anaheim, California, DDi is a leading provider of time-critical, technologically advanced electronic interconnect design, engineering and manufacturing services. DDi offers services to leading electronics OEMs and contract manufacturers worldwide.
Capabilities:
- Faster turnaround Prototype / Pilot lot quantities / Higher volumes
- Multilayer PCBs up to 60 layers
- Defense / Aerospace, ITAR, MIL-PRF-31032, MIL-PRF-55110, MIL-PRF-50884, AS9100, NADCAP
- Rigid, Flex, Rigid-Flex boards
- Maximum panel size: 24” x 30”
- Maximum Board Thickness: 0.300”
- Aspect Ratio: 20:1
- RoHS Compliant
- Trace & Space: 2.5/3 mil (External) & 2/2.5 mil (Internal)
- Minimum Core Thickness: 1 mil
- Minimum dielectric thickness: 1.5 mil
- Minimum mechanical drill size: 4 mil
- Minimum micro-via hole size: 3 mil
- Blind and Buried Via
- High Density Interconnect (HDI) / Microvia
- Back Drilling
- Embedded Resistors / Capacitance
- Edge Plating
- Counter sink
- Edge Milling
- Wire Bondable Soft Electrolytic Gold
- Metal core (Aluminum, Copper)
- Controlled Impedance and Differential Impedance
- Via filling (conductive & non-conductive)
- Multiple surface finishes available for lead-free assembly
- Thick back panels
- High Temperature material
- High Frequency material
- High-speed materials, including Rogers, Panasonic, 4000-13EP, etc.
- Heavy copper up to 6 ounces
- Bonded heat sinks
- Via in pad
- FLAT-WRAP™ Technology, Next Gen SMV®
- RF/microwave applications
- Thermal management solutions
For more details on DDi, click here.
For enquiries on PCB requirements, please contact
Mr. V Ramesh, Mobile : +91.9980047215, E-mail: ramesh@hdctechnologies.com
- Fast Track Prototype PCB Assembly
- Lead-free components and processes
- Single- and double-sided SMT assembly
- 0201 and 0402 chips
- Micro BGA
- Wire bound ICs
- Pin through hole (PTH) assembly
- Press-fit connectors
- Experienced in all range of PCB substrates
- Inert Atmosphere (Nitrogen) wave soldering capability
- Component Baking and Moisture Sensitivity Control as standard
- On Site BGA rework capability
- High velocity forced hot air reflow
- Specialist Processes including Conformal Coating, Potting, Encapsulation and Environmental Stress Screening (ESS)
- In House X-ray for BGA Inspection and mechanical joint analysis
- Automated Optical Inspection (AOI) with in line rework stations
- 3D X-Ray capability for process monitoring and inspection of BGAs and mechanical joints
- Functional test development
- In-circuit test (ICT)
- JTAG boundary scan
